MSV
10.-13.10. 2023
International Engineering Fair
MSV concurrently with the Transport and Logistics and Envitech trade fairs
Transport and Logistics will offer a range of transport and logistics solutions that build on industrial technologies. The expo will be attended by ACCORD PRAGUE, ALTO SYSTEMS, DENIOS, ENPRAG, the Italian company IMANPACK PACKAGING & ECO SOLUTIONS SPA, Kardex, Kasys, SysTech Group and others.
Many new exhibitors will also be introduced, such as the Polish companies ASD SYSTEMS POLSKA and Heverc, the Italian companies Bonotto Packaging and GRUNIVERPAL, the Dutch company Reesink Logistic Solutions BV, in addition to the companies Machinery Movers, OCS OVERHEAD CONVEYOR SYSTEM, SolverTech, TEDOX, TOMEGAS, VendPRO, W rent and EPAL National Committee for Czech and Slovak Republics.
The supporting programme will feature the Markem-Imaje Packaging Live project, a popular packaging line with commented demonstrations in Hall A2.
The main topic of the Envitech trade fair will be circular economics or the system of material reuse. This set of issues is one of the priorities of sustainable development in the European Union and consists primarily in the responsible management of resources and optimization of manufacturing processes.
MSV
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